Question

With surface-mount technology (SMT), the devices should __________

(a) Utilize transistor outline connections

(b) Mount directly

(c) Have parallel connecting pins

(d) Require holes and pads

I got this question in an internship interview.

Question is from Fast Adder & Serial Adder topic in chapter Arithmetic Circuits of Digital Circuits

Answer 1

Correct option is (b) Mount directly

For explanation I would say: Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry, it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.