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During Chemical milling, depth of etch is controlled by which factor of immersion?

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in Advanced Machining by (962k points)
During Chemical milling, depth of etch is controlled by which factor of immersion?

(a) Time

(b) Mask method

(c) Mask area

(d) None of the mentioned

This question was addressed to me in my homework.

My doubt is from Chemical Milling in portion Chemical Processes of Advanced Machining

1 Answer

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Best answer
Right option is (a) Time

For explanation I would say: As the immersion time increases, depth of the etching increases.

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