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The epoxy bond between the heat sink and component is __________

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The epoxy bond between the heat sink and component is __________

(a) Temporary

(b) Loosened

(c) Permanent/semi-permanent

(d) Highend

I got this question in an interview for job.

My query is from Transistor Case and Heat Sinks in division Differential and Multistage Amplifiers of Electronic Devices & Circuits

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Right answer is (c) Permanent/semi-permanent

For explanation: The epoxy bond between the heat sink and component is semi-permanent/permanent. This is done to make the re-work very difficult and at times impossible. The most typical damage caused by rework is the separation of the component die heat spreader from its package.

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